Toshiba

Toshiba TX03 product series – Cortex-M3

七月 14, 2011
By

Toshiba TX03 product series – Cortex-M3

http://www.toshiba-components.com/microcontroller/Cortex.html

Toshiba Electronics Europe (TEE) is now offering the ARM® Cortex™-M3 32-bit RISC microcontroller. Based on the license agreement with Toshiba Corporation, TEE can offer the ARM Cortex–M3 core in high-performance, low power consumption microcontroller solutions. Potential applications will include real-time industrial systems, home appliance solutions and motor vector control products.

The ARM Cortex–M3 32-bit RISC processor is the first ARM processor based on the ARMv7-M architecture and has been specifically developed as a high-performance, low-cost, high efficiency platform.

The Cortex-M3 processor combines high levels of computational and interrupt response performance with a number of enhanced

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Hynix, Toshiba team up on MRAM

七月 14, 2011
By

Hynix, Toshiba team up on MRAM

Peter Clarke  7/13/2011 8:31 AM EDT

http://www.eetimes.com/electronics-news/4217803/Hynix-Toshiba-MRAM?cid=NL_EETimesDaily

LONDON – Hynix Semiconductor Inc. and Toshiba Corp. have agreed to develop spin-transfer torque magnetoresistence RAMs together with both saying that the technology is an important next-generation non-volatile memory.
Once the technology development is completed the companies plan to form a joint venture to produce STT-MRAMs.

As part of the strategic collaboration Hynix and Toshiba have extended their patent cross licensing.
MRAM is non-volatile memory, it is also power efficient and operates at ultra-high speed, the companies said in a joint statement. The initial applications for the technology are expected to be in mobile applications where power efficiency is highly valued.
The companies did not disclose what memory capacities they intend to manufacture first or a timetable for when they expect to be in commercial manufacturing.
Many established semiconductor companies have made MRAMs and it has also been the stimulus for spin-offs and startups including Everspin Technologies Inc. Grandis Inc. and Crocus Technology Inc. However, the commitment by two of the world’s largest manufacturers of NAND flash and DRAM memory to MRAM marks a significant change. The highest capacity MRAMs on the the market are at about 16-Mbit which is considerably behind the 64-Gbit achieved with NAND flash memory using 20-nm class manufacturing processes. However, many developers are seeing MRAM as replacement for DRAM with the benefits of superior scaling and non-volatility.
Toshiba has reportedly said that a recently developed perpendicular magnetic tunnel junction (MTJ) device can be the basic element of gigabit SST-MRAMs that it would expect to be commercial within three or four years. Hynix and Toshiba said they are merging the necessary resources and expertise from the two companies to minimize risk and to accelerate the pace of MRAM commercialization.
"MRAM is a rare gem full of exciting properties, like ultra high-speed, low power consumption, and high capacity, and it will play the role of key factor in driving advances in memories. It will also be a perfect fit for growing consumer demand in more sophisticated smart phones. MRAM is our next growth platform," said Oh Chul Kwon, CEO of Hynix, in a statement.
"We believe that MRAM has huge potential as highly scalable non-volatile RAM," said Kiyoshi Kobayashi, corporate senior vice president of Toshiba Corp. and president and CEO of Toshiba’s semiconductor and storage products subsidiary. "We will strongly promote initiatives in integration of storage solutions including MRAM, NAND, and HDD. The MRAM joint development program with Hynix is one of the key steps to support our efforts."

Related links and articles:
Crocus claims technology allows NAND MRAM
NEC, university make CAM-on-MRAM progress
Russia backs MRAM startup in $300 million deal
IBM, Hynix, Samsung roll STT RAM
MRAM startup MagSil tips technology
Hitachi tips STT-RAM, mulls memory spinoff
Grandis: STT-RAM to replace DRAM, flash
Everspin rocks SRAM boat with 16-Mbit MRAM
Crocus enters STT-MRAM race

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Toshiba offers access to mature technologies and long-life process support for European ASIC customers

二月 6, 2011
By

Toshiba offers access to mature technologies

and long-life process support

for European ASIC customers

Design and support options ideal

for industrial SoC applications

http://press.woodstockwire.com/?q=node/20

Düsseldorf, Germany, 26th January, 2011

– Toshiba Electronics Europe (TEE) has announced that its ASIC and Foundry business unit is offering European customers long-life process support while continuing to make mature ASIC technologies available for new design starts.

Both options will be particularly attractive to customers developing system-on-chip (SoC) solutions for industrial and other medium-volume applications where extended product lifecycles and/or cost optimized design are key criteria.

Alongside its 130nm, 90nm, 65nm, 40nm and forthcoming 28nm processes, TEE continues to support design starts at the 0.6µm (pure 5V), 0.35µm and 180nm nodes originally introduced in 1993, 1995 and 1999 respectively. With lower cost design methodologies and libraries of proven IP blocks that have been created over many years, these mature technologies can help to drive down the design cost of new analogue and mixed-signal applications that do not require the performance or density of more advanced processes. They also offer customers flexible options for existing applications that require second sourcing or obsolescence replacement planning.

Industrial and many other applications have typical product lifecycles that are longer than those associated with consumer products. As a company producing high volumes of ASICs at a variety of technology nodes for customers around the world, Toshiba can offer both attractive pricing models and long-term process support.

The company’s commitment to such long-term process support is reflected in the fact that ASICs based on its TC140 1.2µm technology introduced in 1988 and its TC160 1.0µm technology introduced in 1990 are still in mass production.

“Toshiba is well known for supporting complex consumer applications at advanced technology nodes,” comments Rainer Werner Kaese, TEE’s senior manager for ASIC & Foundry Business Development.

“However, we recognise that there are also many customers in industrial and other markets that won’t necessarily benefit from using these advanced processes for their SoC designs.

By providing these customers with access to more mature technologies we can help them to realise competitive advantage in terms of both pricing and time-to-market.”

He adds: “Irrespective of the technology node chosen Toshiba will always make the best possible effort to support ASIC production as long as there is customer demand in appropriate volume. This is clearly demonstrated by the fact that even today, a significant number of our ASIC products are still based on 0.35µm, 180nm and 130nm processes, and that we continue to manufacture devices using the 1.2µm technology we first introduced over 20 years ago.”

 

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