TI

TI tips IC portfolio for Thunderbolt interface

三月 23, 2012
By

TI tips IC portfolio for Thunderbolt interface

3/22/2012 1:43 PM EDT

http://www.eetimes.com/electronics-news/4304106/TI-tips-IC-portfolio-for-Thunderbolt-interconnect-?cid=NL_EETimesDaily

Texas Instruments claimed to offer the semiconductor industry’s first IC portfolio optimized for the Thunderbolt high-speed interface standard.

SAN FRANCISCO—Texas Instruments Inc. this week claimed to offer the semiconductor industry’s first IC portfolio optimized for the Thunderbolt high-speed interface standard.
Thunderbolt, which was developed by Intel Corp., is an interconnect technology that supports dual 10.3 Gbps transfer lanes, aggregating PCI Express and DisplayPort to enable both data and display over a single cable.
TI (Dallas) claims to be the only chip supplier to provide a full ecosystem of devices for Thunderbolt, allowing customers to do more by offering the right products to speed design.
TI’s initial Thunderbolt product offering includes six devices.

The TPS22980 power load switch resides on both the host and device side, facilitating the delivery and receipt of power to both the active cable and the connected device, TI said.

The LM3017 boost and battery disconnect and HD3SS0001 FET switch work in tandem on the host to connect to the cable where the TPS22985 power load switch, DS100TB211 signal conditioning retimer with clock and data recovery (CDR) and LMZ10501 simple switcher nano module reside, the firm said.. All devices are designed to work seamlessly, TI said.
"Thunderbolt technology brings unprecedented I/O performance and versatility to the PC platform," said Jason Ziller, director of marketing and planning for Thunderbolt technology at Intel.

"Texas Instruments’ new devices will accelerate Thunderbolt product makers’ development and time-to-market, and help accelerate Thunderbolt ecosystem growth."

————————————————————————————

Are you ready for OMAP 5?

三月 23, 2012
By

Are you ready for OMAP 5?

http://www.eetasia.com/ART_8800663237_499489_NP_19bc8746.HTM?8800091821&8800663237&click_from=8800091821,8723946550,2012-03-16,EEOL,ARTICLE_ALERT

Posted:16 Mar 2012

Texas Instruments Inc. is putting its highly anticipated OMAP 5 platform on center stage.

The OMAP 5 will be the newest from TI‘s OMAP processor family that will target smartphones and numerous other markets—from automotive to the http://www.eetasia.com/ART_8800663237_499489_NP_19bc8746.HTM?8800091821&8800663237&click_from=8800091821,8723946550,2012-03-16,EEOL,ARTICLE_ALERT.

According to TI, the platform uniquely enables leading digital hubs to deliver premium content while consumers capture, edit, store, and share their own content across numerous end equipment.

The result is a multimedia-rich, multitasking-intense visual experience without compromise, the company said.

The OMAP platform has long harnessed a balanced system identified as the smart multicore architecture to deliver the highest applications processing performance at the lowest possible power, TI explained.

The evolution of this architecture, that today comprises the OMAP 5 platform, changes what’s possible in mobile computing, and delivers a superior user experience leveraging TI’s mobile-optimized 28nm process, the company added.

Mobile applications benefit from the distribution of interdependent activities across multipleprocessors to create fluid performance and fast responsiveness.

However, in reality most of these applications today are single-threaded or have a dominant single-threaded task or process, and are thereby unable to partition across large numbers of CPU cores within a platform.

Thus, the OMAP5430 processor includes two ARM Cortex-A15 cores that provide the highest single-thread performance of any ARM CPU.

Unique to the OMAP 5 smart multicore architecture is the use of two ARM Cortex-M4 cores to complement the two ARM Cortex-A15 cores.

The M-class cores are appropriately assigned real-time control processing of multimedia tasks, like video encoding and decoding, freeing the main CPU cores to manage high level operating system tasks.

In addition to minimizing the Cortex-A15 cores’ interrupt rate, this off-loading function delivers an invaluable power savings—as much as 10 percent of the system power when encoding and decoding high definition H.264 content, for example.

In a market driven largely by graphics performance, the ability to raise the bar without increasing power consumption is a competitive advantage benefitting any application’s performance.

TI boasts that the OMAP 5 platform represents several upgrades to preceding OMAP processor families, including the introduction of a second GPU.

Through the use of dual-core PowerVR SGX544 GPUs from Imagination Technologies, the OMAP5430 processor outperforms the competition by up to 4x across common industry graphics benchmarks, TI said. Imagination Technologies differentiates its SGX544 cores through the use of a tile-based deferred rendering architecture, which reduces bandwidth usage and minimizes power consumption when compared to competitive solutions.

TI harnesses this graphics performance by complementing the GPUs with unique OMAP platform capabilities, while running the cores at their maximum limit of 532Mhz.

TI further explained that the SGX544 cores are augmented by still another unique OMAP architecture feature, a dedicated 2D hardware-accelerated composition engine that can support up to 8 layers of high resolution composition without the need to go to external memory.

The smart multicore system off-loads compositing to the composition engine, lowering power consumption by as much as 10x what the GPU would expend running the same eight layer composition process, the company noted.

This is done without passing data back to the memory, freeing the memory bandwidth for other multitasking functions.

OMAP 5

The OMAP 5 claims to be the only applications processing platform that can deliver unprecedented performance inside of a sub-two-watt power envelope to meet device and application requirements.

Mobile platforms are constrained to a fixed thermal budget—otherwise a device might feel too hot in a user’s hand. If the processor exceeds this budget, it must be throttled. This is a process that can limit the real performance of the device. Navigating this challenge to yield the ultimate performance within the mobile thermal budget, the OMAP 5 platform balances the right performance to deliver under this thermal constraint the highest possible effective MIPS, reaching upwards of 35 percent greater than the latest quad-core market solutions. Under a realistic thermal budget representing the constraints of a hand-held device, the OMAP smart multicore architecture, coupled with TI’s 28nm process, delivers performance unachievable by other processors—whether they leverage the same or different numbers and types of CPUs.

As today’s users expect DSLR-like performance from their mobile devices.

The OMAP 5 platform’s image signal processor delivers lighting fast capture of 16MP in 0.5s, 24MP at 30fps with zero shutter lag, and enhanced low-light performance.

It also enables a device to use four simultaneous camera sensors for new end user applications.

For example, users operating OMAP 5 processor-driven devices are also able to capture 1080p 60fps video while simultaneously taking 12MP still images. TI’s advanced camera APIs will also support new features like night shot, advanced HDR and digital re-focusing, which allows users to focus an image even after the picture is taken.

"We have achieved a superior design in the OMAP 5 platform, setting it in a class all its own," said Remi El-Ouazzane, vice president and general manager, OMAP platform business unit, TI. "The market requires unprecedented performance inside of a sub-two-watt power envelope to meet device and application requirements.

The OMAP 5 platform is the industry’s only applications processing platform capable of delivering on that need—creating the ultimate, most exciting end user experience possible in the market’s current timeframe while setting the stage for what’s to come," El-Ouazzane added.

————————————————————————————–

Create intelligent and efficient lighting products with TI’s new Piccolo™ MCU digital AC LED Lighting and Communications Developer’s Kit

一月 24, 2012
By

 

Create intelligent and efficient lighting products

with TI’s new Piccolo™ MCU

digital AC LED Lighting and Communications Developer’s Kit

http://www.prnewswire.com/news-releases/create-intelligent-and-efficient-lighting-products-with-tis-new-piccolo-mcu-digital-ac-led-lighting-and-communications-developers-kit-137473163.html

New AC mains-powered, intelligent LED lighting kit integrates efficient power supply design, smart lighting features and remote connectivity with optional PLC Add-on Kit and software

TEXAS INSTRUMENTS INCORPORATED LOGO</p>
<p>Texas Instruments Logo. (PRNewsFoto/Texas Instruments Incorporated)<br />
DALLAS, TX UNITED STATES<br />

HOUSTON, Jan. 17, 2012 /PRNewswire/

— Enabling designers to cost-effectively incorporate intelligence and remote connectivity into LED lighting designs and get to market faster, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced its new 32-bit TMS320C2000™ Piccolo™ microcontroller (MCU) AC LED Lighting and Communications Developer’s Kit. 

Leveraging the performance of low-cost Piccolo MCUs, the LED Lighting and Communications Developer’s Kit is a complete mains-powered LED lighting solution with software that allows designers to create lighting products featuring full dimming, remote connectivity and efficient power stage design perfect for street, outdoor, commercial, industrial, and entertainment lighting applications. 

A separate plug-in compatible, Piccolo MCU Power Line Communications (PLC) Add-on Kit further allows developers to experiment with development of PLC-based lighting designs.

Piccolo F2802x MCU AC LED Lighting and Communications Developer’s Kit features and benefits:

  • Complete solution speeds customer development and provides a differentiated platform for AC mains-powered, intelligent luminaries. 
  • Provides simple, efficient and full-featured LED lighting power supply design enabling higher energy efficiencies, reduced manufacturing costs and product adaptability to varying design and implementation needs.
  • Includes hardware and software support for remote connectivity, walking developers through implementation examples of leading lighting communications protocols such as DALI, DMX512 and PLC.
  • Enables low-cost integrated intelligence via the benefits of digital design with Piccolo MCUs, such as independent and multi-string dimming up to 250W, fault management, light balancing, dimming profiles, data logging and more.
  • With Piccolo MCU-based power supply and lighting control, customers need only one design to support multiple end product classes. Leave the power stages unchanged and simply adjust the number of LED strings to create a full product family. 
  • Features C2000′s modular controlCARD concept, allowing developers to experiment with various C2000 MCUs to fit price, performance and peripheral feature set requirements.
  • Includes controlSUITE software, providing easy-to-use open source demonstration GUIs, software examples and documentation for full closed loop control of an AC/DC power supply, multi-string LED control and advanced communications.

Piccolo F2803x MCU PLC Add-on Kit features and benefits:

  • Enables experimentation with PLC in lighting using PLC-Lite.
  • Adds cost effective energy metering, remote diagnostics or remote control without the need for additional wiring or external communications modules.
  • Features a plug-in PLC daughter board and drop-in replacement Piccolo F2803x MCU, enabling the hardware support and control performance necessary for PLC. 
  • Communicates with the C2000 Power Line Modem Developer’s Kit (sold separately) to easily demo PLC.
  • Includes controlSUITE software and PLC software suite for easy-to-use and open source demonstration GUIs, software examples and documentation for PLC technology.

Pricing and availability

The new Piccolo AC LED Lighting and Communications Developer’s Kit (TMDSIACLEDCOMKIT) is priced at $699 USD and is immediately available for order. 

Also available for order is the Piccolo PLC Add-on Kit (TMDSPLCMODA-P3X) for $215 USD  and can be ordered now. 

controlSUITE software is free and can be accessed immediately.

  PLC software and documentationis also available now.

Find out more about TI’s lighting solutions by visiting the links below:

TI’s broad portfolio of microcontrollers (MCUs) and software

From general purpose, ultra-low power MSP430™ MCUs, to Stellaris® Cortex™-M MCUs to real-time control C2000™ MCUs, and Hercules™ safety MCUs, TI offers the broadest range of microcontroller solutions.

Designers can accelerate time to market by tapping into TI’s complete software and hardware tools, extensive third-party offerings and technical support.

 

————————————————————————————————————

SYS/BIOS Real-Time Operating System (RTOS)

一月 24, 2012
By

SYS/BIOS Real-Time Operating System (RTOS)

http://www.ti.com/tool/sysbios

Description

Advanced RTOS Solution

SYS/BIOS™ 6.x is an advanced, real-time operating system for use in a wide range of DSPs, ARMs, and microcontrollers.

It is designed for use in embedded applications that need real-time scheduling, synchronization, and instrumentation.

It provides preemptive multitasking, hardware abstraction, and memory management.

Compared to its predecessor, DSP/BIOS™ 5.x, it has numerous enhancements in functionality and performance.

SYS/BIOS 6.x is currently available for

TI C64x+ core based devices (including the OMAP35x™ and DaVinci™ digital video processors),

 TMS320C674x™ devices (including OMAP-L13x),

TMS320C66x™ multicore processors,

Sitara™ ARM9® Cortex A8® microprocessors,

as well as TMS320C28x™,

Stellaris™ Cortex M3™,

and MSP430™ microcontrollers.

SYS/BIOS 6.x is provided with full source code and requires no runtime license fees.

SYS/BIOS 6.x is available both standalone and

as an integral part of the Code Composer Studio™ Interactive Development Environment (CCStudio IDE) v4.x

and v5.x.

Within CCStudio, SYS/BIOS 6.x provides a number of handy project templates to use as a starting point for your application.

A graphical configuration tool helps you create the static configuration used by SYS/BIOS 6.x at build time.

In addition, a Runtime Object Viewer (ROV) and analysis tools focus on debugging and tuning multitasking applications.

SYS/BIOS 6.x is backed by an experienced development, training, and support organization that ensures product quality and availability on the latest TI devices.

Additional Information


Features

SYS/BIOS 6.x Overview

SYS/BIOS 6.x and its associated IPC and XDCtools components provide a rich set of C-callable, deterministic kernel services that enable developers to create sophisticated applications without compromising real-time deadlines.

In SYS/BIOS 6.x, the services provided in DSP/BIOS 5.x have been separated into three separate packages.

Logging, tracing, and memory management services are provided by the XDCtools component, which enables them to be used by other applications that do not need a multitasking scheduler.

Likewise, the Inter-Processor Communication (IPC) component, which provides message passing and other IPC mechanisms, is independent of the core SYS/BIOS 6.x kernel functionality.

As a result, you can use the IPC APIs to facilitate communication between subsystems running different operating systems.


Objects from all three components are configured, built, and traced using a common tool infrastructure, providing a seamless user experience.

SYS/BIOS 6.x offers the following enhancements compared to DSP/BIOS 5.x:

  • Faster multitasking performance
  • Reduced latency for critical interrupts
  • Event object
  • Customizable memory manager
  • Faster, more deterministic variable-sized memory allocation
  • Priority-inheritance gates
  • Hwi and Swi hook functions
  • Up to 32 priority levels
  • Extensible tooling
  • Per task CPU load
  • Support for interrupts and dynamically-created objects in the execution graph
  • API parameter checking

Developers can use graphical tools or a text editor to configure SYS/BIOS 6.x and to minimize the memory footprint.

Object instances can be created either statically through the configuration or dynamically using API calls.

In addition to excluding unused modules, static configuration further reduces the target memory footprint by eliminating the code required to dynamically create and delete operating system objects such as threads and semaphores.


What’s Included
  • SYS/BIOS 6.x is delivered as part of Code Composer Studio IDE v4 and v5. CCStudio also includes the XDCtools component, which provides the graphical configuration editor and the ROV and RTA tools.
  • Purchase of CCStudio includes a royalty-free license to use SYS/BIOS 6.x in your project.
  • The SYS/BIOS 6.x, IPC, and XDCtools components may also be downloaded independently of the CCStudio IDE at no charge.

 

 

————————————————————————————————

AFE030

一月 24, 2012
By

AFE030   Powerline Communications Analog Front-End

Functional Diagram


Description

The AFE030 is a low-cost, integrated, powerline communications (PLC) analog front-end (AFE) device that is capable of capacitive- or transformer-coupled connections to the powerline while under the control of a digital signal processor (DSP) or microcontroller.

It is ideal for driving low-impedance lines that require up to 1.0 A into reactive loads.

The integrated receiver is able to detect signals down to 20 µVRMS and is capable of a wide range of gain options to adapt to varying input signal conditions. This monolithic integrated circuit provides high reliability in demanding powerline communications applications.

The AFE030 transmit power amplifier operates from a single supply in the range of 7 V to 26 V.

 

———————————————————————————————–

IAR Systems Releases Complete Starter Kit for Texas Instruments Hercules Safety Device

一月 24, 2012
By

January 18, 2012 05:09 AM Eastern Time 

http://www.businesswire.com/news/home/20120118005647/en/IAR-Systems-Releases-Complete-Starter-Kit-Texas

IAR Systems Releases Complete Starter Kit for Texas Instruments Hercules Safety Device

UPPSALA, Sweden–(BUSINESS WIRE)

–IAR Systems today announces that IAR KickStart Kit™ for Texas Instruments Hercules™ RM48 MCU is released and available for order.

The Hercules safety microcontroller platform from Texas Instruments Incorporated (TI) has built-in hardware safety features, making it suitable for development of systems with high requirements on functional safety, for example within medical, industrial, and transportation applications areas.

The Hercules safety platform consists of three ARM® Cortex™-based microcontroller families:

TMS470M, TMS570 and RM4x.

The RM4x family provides the highest performance, and is based on ARM Cortex-R4F.

IAR KickStart Kit for TI Hercules RM48 is the first ARM Cortex-R4F kit from IAR Systems, making it a valuable addition to the large number of IAR KickStart Kit packages available for several different architectures from a wide array of semiconductor manufacturers.

This is a bundled kit, including a full-featured TI Hercules TMDXRM48HDK kit and an IAR J-Link Lite debug probe, which enables fast and stable debugging with advanced debug features offered by IAR Embedded Workbench.

Also included in the kit are software tools and example applications from IAR Systems and Texas Instruments, supplying all the software and hardware necessary to design, develop, integrate, and test applications.

IAR KickStart Kit for TI Hercules RM48 is in stock and available in the IAR Systems e-shop.

It is priced at EUR 220/USD 279. The part number is KSK-TMDXRM48HDK-JL. Details are available at www.iar.com/kits.

Editor’s Note:

IAR Systems, IAR Embedded Workbench, C-SPY, visualSTATE,

The Code to Success, IAR KickStart Kit, IAR and the logotype of IAR Systems are trademarks or registered trademarks owned by IAR Systems AB. J-Link and J-Trace are trademarks licensed to IAR Systems AB.

All other products are trademarks of their respective owners.

————————————————————————————————–

TI 推出高效能 Sitara™ ARM® 微處理器 AM335X

十二月 1, 2011
By

http://www.ti.com.tw/news/newsdetail.asp?scid=TIA-11104

TI 推出高效能 Sitara™ ARM® 微處理器 AM335X

為業界首款 5 美元高效能、特性豐富ARM Cortex™-A8 裝置

支援 3D 圖形、觸控式螢幕、高速乙太網和高頻寬連結等功能
提升現有 ARM9™ 設計,且無需增加成本或功耗

  • 産品可在 6 個月內推出上市,採用參考售價 89 美元的簡易開放原始碼硬體平台與免費軟體開發套件,
  • 支援 Android、Linux 以及 Windows Embedded Compact 7
  • 添加更高的功能性至可攜式導航系統、掌上型遊戲和教育類裝置,以及家庭/大樓自動化等
  • 無縫移植,可自使用高度彈性軟體和工具等其他 ARM 設計方案

http://www.ti.com/ww/tw/sitara_whatsnew.html

=================================================================

TI New for Tools & Software

十一月 25, 2011
By

New for Tools & Software

http://www.ti.com/dsp/docs/dspsupportnp.tsp?sectionId=3&tabId=2023

——————————————————————–

Enhance your industrial designs with two new development options:

introducing TI’s Industrial Development Kit and Industrial Communications Engine

November 22, 2011

———————————————————————

Enter a world of fast, low-cost embedded processing design with TI’s dramatically enhanced Code Composer Studio™ IDE

November 8, 2011

———————————————————————-

TMDXIDK3359 Tool Folder
TMDXIDK3359 Tool Folder

TMDXICE3359 Tool Folder
TMDXICE33559 Tool Folder

AM3359 Product Folder
AM3359 Product Folder

—————————————————————————

TI超低價BeagleBone開發板實現10s Linux啟動

十一月 25, 2011
By

嵌入式技術

TI超低價BeagleBone開發板實現10s Linux啟動

上網時間:2011年11月08日

德州儀器(TI)日前宣佈,旗下的 BeagleBoard.org 推出最新成員 BeagleBone 開始原始碼開發平台,可讓開發人員更便利地進行各種發明,如無線網路化自動機器人、自學電子教育套件、智能電子看板、高彈性復古遊戲裝置以及家庭自動化等。

TI表示, BeagleBoard 淡化了桌上型電腦與嵌入式運算之間的界限,為基於 ARM 處理器開放原始碼的創新大幅加速鋪路。

參考售價 89 美元的最新開發板 BeagleBone 建立在德州儀器 (TI) Sitara AM335x ARM Cortex-A8 微處理器之上,可為電子愛好者、開發人員以及工程師帶來最優質的開放原始碼開發。在提供可存取至感測器與控制介面訊號的準系統 (bare bone) 同時,使用單線開發環境取消對額外設備的需求。

高彈性 Linux 核心能簡化在 BeagleBone 上各種感測器和控制的工作開發,透過使用現有驅動器與介面應用,該核心可降低學習輸入╱輸出 (I/O) 複雜度。BeagleBone 運行功能全面的 Linux,包括原生腳本 (native scripting) 與編譯工具等。此外,它還提供內建乙太網 MAC、支援 PHY 的 USB 與 A/D 轉換器以及無數其他週邊,可將所需的外部元件數量減至最低,進一步簡化設計。

BeagleBone 可作為獨立開發板使用,或現有 BeagleBoard、BeagleBoard-xM 或桌上型電腦的插件,以連結數千個可用的感測器與週邊。BeagleBone 具有 60 多組可配置產業標準 3.3 伏特 I/O,支援 5 個序列埠、2 個 I2C 匯流排、定時器、電源管理模組以及 SPI 等,為額外週邊提供簡易連結,提高設計彈性。開發人員還可造訪開放原始碼社群,其為編程提供大量 I/O 參考。BeagleBoard.org 為現今最活躍的開放原始碼硬體社群之一,可提供持續不斷的支援。

BeagleBone 可簡化電路板的軟硬體設定,幫助開發人員透過預安裝 Angstrom Distribution 與 node.js with Cloud9 IDE,在 5 分鐘內啟動開發。開發人員使用單個 USB 線便可為電路板供電,並將 Web 瀏覽器指向電路板,實現與 Windows、Mac 以及 Linux 的友善開發與相容性。整合型 USB 集線器可進一步支援更多同步低階序列控制台,以及廣泛支援的 JTAG 硬體除錯連結,其中包括 TI 的 Code Composer Studio 整合型開發環境 (IDE)。立即啟動公開測試版開發,板載範例庫適用於教育與快速進行原型設計,進一步加速開發。

BeagleBone 採用 TI 720 MHz 的 AM335x ARM Cortex-A8 微處理器,支援超過 1,400 的 Dhrystone MIPS; 運行全面的 Linux 作業系統,支援功能齊全的 Web 伺服器、原生編譯器和腳本語言以及視訊分析庫等。

它提供2 個 46 接腳、2 排 0.1 吋間距的擴展接頭母座 (female expansion header);使開發人員能夠簡易地添加現成的擴展硬體,或將實驗電路板 (breadboard) 直接連結至無數立即可用的週邊。

BeagleBone的板載集線器支援多用途 USB 裝置連結,USB 至序列╱JTAG 轉換裝置支援軟體重設,以及可再編程高速 USB 裝置介面; 開發人員只需插入一條線便可供電、除錯以及連接至應用,無需 JTAG 模擬器,便可節省額外的成本。BeagleBone亦支援 Open GL ES 2.0 的 3D 圖形加速器,可實現模擬遊戲的即時像素圖形,以及 3D 使用者介面加速。

另外,BeagleBone支援低速、全速及高速的 USB 2.0 主機埠; 可用於鍵盤、滑鼠、WiFi、藍牙 (Bluetooth)、Web 照相機或 USB 集線器等 USB 週邊,透過內建 USB PHY 實現更多擴展;microSD 連結器可為啟動影像及資料提供更多 GB 的儲存空間。

內建的 10/100Mbit Gigabit 乙太網能 以最少軟體堆疊連結網路。

BeagleBone還提供4 個板載 LED,無需添加額外的硬體,便可提供使用者狀態。

此文章源自《電子工程專輯》網站:
http://www.eettaiwan.com/ART_8800655118_676964_NP_deb0de46.HTM
http://www.eettaiwan.com/ART_8800655118_676964_NP_deb0de46.HTM

http://beagleboard.org/

—————————————————————————–

TI Code Composer Studio (CCStudio) Integrated Development Environment (IDE) v5

十一月 18, 2011
By

Code Composer Studio (CCStudio) Integrated Development Environment (IDE) v5

Status: ACTIVE

Description

Effective 08 November 2011

  • If you already purchased CCStudio Platinum (ALL) v4 and have a valid subscription:Effective November 8, 2011, go to www.ti.com/myregisteredsoftware. Click Manage. Click “Upgrade – Get new license” to access CCStudio v5
  • If you already purchased CCStudio Microcontrollers (MCU) v4 and have a valid subscription: During November, you will receive an upgrade copy of ALL v5. Look for an email from myRegistered_Software@list.ti.com. Use the Activation ID and instructions to activate your new CCStudio v5.
  • To order CCStudio for the first time: See all CCStudio part numbers below. Some still ship v4. All will be shipping v5 by late November. If you receive v4, please complete the activation instructions in myRegisteredSoftware. Then click "Manage" and "Upgrade – Get new license" to access CCStudio v5. For assistance see FAQ.
  • To renew subscription: Go to www.ti.com/ccs_subscriptions
  • To download free evaluation software: Go to:processors.wiki.ti.com/index.php/Download_CCS
  • If you have questions about downloading your software: Go to: www.ti.com/software-help

Code Composer Studio™ (CCStudio) is an integrated development environment (IDE) for Texas Instruments’ (TI) embedded processor families. CCStudio comprises a suite of tools used to develop and debug embedded applications. It includes compilers for each of TI’s device families, source code editor, project build environment, debugger, profiler, simulators, real-time operating system and many other features. The intuitive IDE provides a single user interface taking you through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before and add functionality to their application thanks to sophisticated productivity tools.

Code Composer Studio is based on the Eclipse open source software framework.

The Eclipse software framework was originally developed as an open framework for creating development tools. Eclipse offers an excellent software framework for building software development environments and it is becoming a standard framework used by many embedded software vendors. CCStudio combines the advantages of the Eclipse software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers.

Code Composer Studio supports running on both Windows and Linux PCs.

Not all features or devices are supported on Linux please see Linux Host Support for details.

 

—————————————————————————————————–

http://www.ti.com/tool/ccstudio?HQS=dsps_ccstudio_111113&DCMP=mytinwsltr_11_12_2011&sp_rid_pod3=LTg2NDY5NjQzMwS2&sp_mid_pod3=4968551——————————————————————————————————————

Tag cloud