Intel rolls six merged Atom, FPGA chips
11/22/2010 1:57 PM EST
Intel Corp. has rolled out the first six members of a new line of system-in-package products announced in September that include Atom and Altera FPGA die.
SAN JOSE, Calif. – Intel Corp. has rolled out the first six members of a new line of system-in-package products announced in September that include Atom and Altera FPGA die.
The devices are geared to expand Intel’s drive into embedded markets with the x86-based Atom.
The E600C series aims to help embedded designers speed Atom-based chips to market.
The FPGA blocks let engineers customize the devices for whatever interfaces or unique features their system requires.
The high–end chip uses a 1.3 GHz Atom with a 400 MHz graphics block consuming 3.6W and costing $106.
The low-end device runs at 600 MHz with a 320 MHz graphics block, consumes 2.7W and costs $61.
The Altera FPGAs inside the 37.5mm2 package use more than 60,000 logic elements and can support six high-speed transceivers using more than 350 I/O pins. The transceivers can run at up to 3.125 Gbits/s or support LVDS links with serdes at 840 Mbits/s.
The FPGAs can be programmed with the Altera QuartusII Subscription Edition tools.
They include PCI Express logic, DSP multipliers and some internal memory.
They leave an undisclosed amount of room for OEM custom logic.
Formerly codenamed Stellarton,
the Intel Atom processors E665CT, E645CT, E665C, and E645C are scheduled to be available within 60 days.
The E625CT and E625C are on track to be available in the first quarter of 2011.
Board maker Kontron has E600C-based prototype boards available now, with full production beginning in the second quarter of 2011.
The chips come with seven-year manufacturing support and support industrial and commercial temperature options.
Some devices operate at 0 to 70 degrees C, others at -40 to 85 degrees C.
“Our new configurable Atom series helps to address these customer needs and provides greater flexibility with a simplified product choice, through one vendor,”
said Doug Davis, general manager of Intel’s Embedded and Communications Group, speaking in a press release.