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飛思卡爾推64位元QorIQ系列多重核心處理器

九月 1, 2011
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飛思卡爾推64位元QorIQ系列多重核心處理器

http://www.eettaiwan.com/ART_8800646120_622964_NP_ea64642c.HTM

Architecture

飛思卡爾半導體(Freescale Semiconductor, Inc.)日前推出新一代 QorIQ 多重核心處理器。先進多重處理(AMP)系列整合了新式的多執行緒64位元 Power Architecture 核心、28奈米製程技術、最多達24個虛擬核心、新型加速引擎、以及複雜的功率管理,大幅提升了嵌入式處理器的效能及功率效益。

在全球網路設備及相應的IP流量暴增的情況下,飛思卡爾表示,AMP系列的設計可協助網路設備OEM及服務供應商因應嚴格的功率與效能需求。據Cisco預估,全球IP通訊在2015年時將增加四倍,並以每年可達966 exabyte。該公司同時預估,光是從2014到2015年間的IP通訊成長量就高達200 exabyte,比2010一年全球產生的總IP通訊量還要高。

而飛思卡爾的新款AMP系列處理器融合了效能、功率及智慧性整合,可協助應付上述網路問題、以及其它市場的嚴苛需求,如軍事/航太、工業用、自動化機器、儲存、醫療、影像系統及印表等。

新款QorIQ AMP系列具備飛思卡爾獨有的智慧性整合特色,較以往飛思卡爾前一代旗艦級八核心QorIQ P4080元件提供多達4倍的效能。AMP系列包含種類豐富的次世代控制與資料面處理器,從超值低功率單核心型產品、到以最嚴苛的網路、工業用及軍用/航太應用為目標的高度先進單晶片系統都一應俱全。

飛思卡爾QorIQ AMP系列的基礎是新式的多執行緒、64位元Power Architecture e6500核心,時脈達2.5 GHz。e6500同時適用於高階控制層面及高效能的資料層面應用,因此它將會是所有AMP系列產品的核心。e6500整合了改良過的AltiVec向量處理單元,這是一款迭經考驗、效能傑出、廣受喜愛的裝置。AltiVec技術最擅長應付高頻寬資料處理及繁重演算,因而能夠為飛思卡爾的客戶提供DSP等級的效能及其它諸多優點。

在可程式化e6500核心背後支援的,是範圍廣泛的高度先進加速引擎、以及輔助處理技術,如改良安全性、樣式比對和壓縮/解壓縮引擎,再加上飛思卡爾的資料路徑加速(DPAA)和QUICC引擎等技術。AMP系列的壓縮/解壓縮技術,提供了20 Gbps的效能,而新款SEC 5.0加密加速器高達40 Gbps的效率則減輕了協定處理的負荷,如LTE、IPSec、以及SSL,同時還為現有及未來的無線和有線演算法提供接近140 Gbps的原生加密硬體加速。其它新款加速/緩和技術也一併納入,以支援新一代的regex加速、128位元SIMD資料預取、內部解譯和分類、以及服務品質區隔(QoS)功能等等。

AMP系列同時也內建許多前一代QorIQ的突破性技術,如CoreNet互連結構、連續快取記憶體架構、讓效能最佳化的虛擬化硬體、以及晶片內動態除錯技術,為複雜的軟體程序提供深入的觀點。

為了滿足更嚴苛的OEM功率限制需求,AMP系列產品運用了先進的功率管理方法,以可變模式功率開關來降低能源損耗,讓客戶精確地個別調整核心及其它處理單元的功率。

是飛思卡爾第一款QorIQ AMP系列產品是T4240,它整合一系列的硬體加速器,以及12個雙執行緒e6500核心,提供總共24個執行緒,以便處理高階的資料面處理應用。雙執行緒的效益、每執行緒改善的DMIP及更高的頻率,構成4倍的效能增益,以及比前一代QorIQ P4080元件超過2倍的功率效益。先進的功能則有助於共享智慧、並在執行緒間複製資源,每核心的晶片內建快取也更大。T4240元件的應用範例則包括都會載波用邊緣路由器、存取閘道器、以及航太/國防用產品。飛思卡爾今年稍晚將提供更多關於T4240產品的細節。預計該元件將於2012年初問世。

AMP系列與PowerQUICC和QorIQ產品系列均軟體相容,且具有廣泛的研發支援,包括CodeWarrior研發套件及豐富的第三方週邊如作業系統、工具及應用軟體。AMP系列的研發工具預計於2012年第一季供貨。

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Microsemi FPGA協助推動智慧電網與電動汽車進展

八月 30, 2011
By

Microsemi FPGA協助推動智慧電網與電動汽車進展

http://www.eettaiwan.com/ART_8800643920_480102_NP_4bb47925.HTM

美商美高森美公司(Microsemi Corp.)宣佈該公司正與電力線通訊開發商 Ariane Controls 合作,為業界開發平台提供 ProASIC3 FPGA 技術,以支援關鍵的新興電動汽車充電和相關的智慧電網標準。

Ariane Controls 的 AC-CPM1 AutoGrade J2931 評估和開發板,充分運用Microsemi的ProASIC3 flash FPGA 性能與彈性,因此得以縮短為實現汽車標準 J2931,電動汽車(Electric Vehicle;EV)和電動汽車供應設備(Electric Vehicle Supply Equipment;EVSE)之間通訊的系統設計週期。Microsemi的ProASIC3系列FPGA是符合Grade 1 AEC-Q100汽車規格的解決方案,可承受的接合點溫度高達攝氏135度。

Ariane Controls 的 AC-CPM1 AutoGrade J2931 平台採用Microsemi的 ProASIC3 flash FPGA 來執行Ariane已驗證的 PLM-1 智財區塊(IP block),其提供了一種簡單,可靠,經濟的方法,在現有線路上傳輸資料。

Microsemi的ProASIC3 flash FPGA可大幅降低自體發熱問題,允許在較高的溫度下作業,增加設計餘裕(design margin),同時也有助於延長產品壽命。他們可以抵抗中子撞擊所引起的韌性配置錯誤,和基於SRAM的FPGA相較,消除了配置記憶體錯亂的風險,因而使它們適用於汽車動力傳動裝置和安全系統。

Ariane Controls 汽車發展主管Mario Lepage表示, AC-CPM1 AutoGrade J2931 平台充分利用Microsemi的 ProASIC3 FPGA,可在嚴酷的汽車環境下進行系統評估和開發。

這個新的設計實現了Ariane的技術,最佳化用於電動汽車和電動汽車供應設備間,標準化 J1772 連接器控制線上的通訊,為汽車製造商和充電站設備商提供一個開發平台,從而為下一代電動交通工具潛在的通訊方式進行測試與評估。」

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設計方案交流

八月 13, 2011
By

設計方案交流

電子工程專輯網站

http://forum.eettaiwan.com/FORUM_POST_1000039157_1200117703_0.HTM?post_hotdownload

正在爲尋找合適的設計方案急得團團轉?有好的設計方案卻苦於不被人知?

設計方案交流專區致力於滿足電子設計方案交流的需求,

藉由更多的溝通與方案搜尋,幫助工程師以更快速度完成產品的開發。


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MEMS感測器正不斷擴張應用版圖

八月 13, 2011
By

專家觀點:MEMS感測器正不斷擴張應用版圖

上網時間: 2011年08月02日

http://www.eettaiwan.com/ART_8800648165_480502_NT_b1e72bdd.HTM

急遽下滑的價格、大幅改善以簡化設計的軟體工具等因素,可望成為推動慣性感測器(inertial sensor)新一代應用,為行動消費性裝置帶來差異化的動力;雖然首度內建微機電系統(MEMS)加速度計的 iPhone以及 Will遊戲機,藉由引進體感控制掀起了使用者介面革命,產品設計者還是花費好一番工夫,才釐清該如何充分發揮慣性感測器的性能。

現在,拜價格下滑以及相關設計知識基礎與環境走向成熟、感測器設計更簡便之賜,慣性感測器正準備進軍更廣泛的體感控制與精準定位(location)應用;市場研究機構Yole Developpement預估,那些新發展將推動加速度計、磁力計等元件在手機內的滲透率,於五年內達到近五成。

目前陀螺儀幾乎已經是所有平板裝置的基本配備,主要是因為蘋果(Apple) iPad 佔據該市場的九成以上。

此外Yole Developpement也預期,慣性感測器在消費性電子領域的應用規模,將在接下來五年達到平均每年24%左右的成長,出貨量將在2015年達到50億顆。

不過慣性感測器在遊戲領域以外的應用,目前看來還是有某種程度的侷限;加速度計已經是手機產品提供螢幕畫面橫式與直式切換功能的必要配備,也有部分產品運用於提供計步器功能。磁力計則是在去年獲得手機產品的大量採用,以提供正確的導航指向功能。另外多軸(multiaxis) MEMS陀螺儀則因剛達到消費性產品可接受的價格點與產能,首度進軍手機、並已幾乎進駐所有平板裝置,初期以遊戲的應用為主。

更低的價格將有助於激勵更廣泛的採用;Yole預見離散式慣性感測器元件價格將持續下跌,以三軸加速度計為例,將由2010年的0.7美元,到2015年跌至0.3美元或是每軸低於0.1美元。這類方案成本下跌的部分原因,是因為能將加速度計與磁力計、或是加速度計與陀螺儀封裝在一起,讓兩顆感測器裝置能分享一顆ASIC控制器;這也能改善感測器資料。

另一個推動MEM感測器滲透率的原因是,越來越容易將感測器輸出資料轉換成有用的應用;包括 ST 、 InvenSense 等領導級供應商都可提供越來越多的軟體與程式庫,讓手機與平板裝置廠商能更容易地將基本體感控制功能加入系統產品中。

運動感測器軟體專門供應商如Movea與Hillcrest Labs,也可提供設備無關(device-agnostic)的軟體工具,以支援更廣泛的應用,特別是無線空中滑鼠(air mice)、電視遙控器等可透過手勢操控的應用。此外,最新版的 Android 作業系統支援部分運動處理應用程式介面(API),未來的版本預期將會支援更精密的動作,

LG的 Android手機 Optimus Black 採用了一顆陀螺儀,以提供方便的單手操控介面,使用者能藉由傾斜手機來切換螢幕畫面(在手機側邊的一個拇指按鈕能啟動陀螺儀);這是採用MEMS新創公司InvenSense陀螺儀的首款產品,這家小型無晶圓廠供應商能拿到如此規模龐大的設計案,意味著MEMS產業鏈的代工技術已經邁向成熟、產量也趨於穩定,還有無論是InvenSense或Android的軟體支援,都能很順暢地將感測器資料轉換成各種功能。

陀螺儀在短時間內看來也會應用於改善手機拍攝影像的穩定性,目前該元件還已經被應用在電視遙控器中,以簡化網路電視的使用;目前LG新推出的、支援點與點擊(point-and-click)遙控功能的一款電視產品,就配備了Hillcrest Labs的體感控制軟體,可進行感測器資料融合、校準與訊號處理,移除資料中的瑕疵與補償溫度變化,以產生更精確的資料流,再將之與滑鼠指向功能結合,提供精密的點與點擊功能,讓電視功能操控更簡便。

而推動慣性感測器在可攜式消費性產品應用的主力,

看來將會是對於更精確定位與導航資訊的需求;

根據GPS晶片組供應商表示,

他們的客戶正在尋找更具可靠性的行人導航功能,

可結合戶外與戶內地圖以支援位置感知搜尋(location-aware searches),

能允許使用者查找所需地點資訊。

而加速度計與磁力計是這類導航功能的關鍵,搭配陀螺儀與壓力感測器,就能精確追蹤使用者的步伐與方向之改變,以及在無線或衛星訊號收不到的地方推測使用者位置。

一些基礎建設也正在發展中,例如在美國,服務供應商Point Inside等已可提供一些購物中心與機場的室內地圖與位置服務,可結合商店促銷資訊;而商店內的資料搜尋與擴增實境等功能,將需要精確度更高、低漂移(low drift)的一整套感測器,將精確度由數十公尺進一步提升到數公尺之內。

編譯:Judith Cheng

(參考原文: Consumer electronics turn to MEMS for gesture control, precision location,by Laurent Robin;本文作者為Yole Developpement分析師。)

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Bluetooth Low Energy, Zigbee, and cognitive 3D-ICs add muscle to telehealth

二月 16, 2011
By

Bluetooth Low Energy, Zigbee, and cognitive 3D-ICs add muscle to telehealth

http://www.eetimes.com/design/communications-design/4213052/Bluetooth-Low-Energy–Zigbee–and-cognitive-3D-ICs-add-muscle-to-telehealth?cid=NL_CommsDesign

Pierre Gandolfo, TrIP-Sen

2/10/2011 4:07 PM EST

Technical and regulatory roadblocks have prevented the telehealth market from reaching its full potential. However, this situation could change with the introduction of a modular, reconfigurable and cognitive 3D-IC approach. With one seventh of the world’s population overweight and an elderly population expected to double to 1.2 billion by 2025, healthcare expenditures in developed countries are exploding. This situation, compounded by the scarcity of qualified medical personnel (general practitioners, nurses, etc.), and an at-stake tax base as the first baby boomers are about to retire, are fueling an increased demand for telehealth solutions. Through the remote collection and regular transfer of physiological parameters, telehealth can be seen as a tool of increased productivity and quality of care since it has the potential to help improve physical fitness, reduce the cost of chronic disease management, and allow elderly people to remain living in their own home.

 

The Continua Health Alliance, an industry consortium promoting telehealth and guaranteeing end-to-end interoperability from sensors to health record databases, has defined in its version 1.5 design guidelines, a dual interface for communication with physiological and residential sensors (See Figure 1) showing a Personal Area Network (PAN) interface based on the recently approved Bluetooth Low Energy (BLE) standard and its health device profiles, and a Local Area Network (LAN) interface, based on the Zigbee Health Care application profile. Both standards are relatively similar in terms of complexity but BLE, as it name implies, tends to have a longer battery life primarily due to the use of short packet overhead and faster data rates, reduced number of packet exchanges for a short discovery/connect time, and skipped communication events, while Zigbee benefits from a longer range and better reliability with the use of a robust modulation scheme (Direct Sequence Spread Spectrum with orthogonal coding [32,4]) and a mesh-like clustered star networking technology.

Figure 1: Continua Health Alliance PAN and LAN interfaces (v1.5)

Both interfaces are well adapted to their respective usage context, from on-the-move on one hand to home use or assisted care facilities on the other, but the flip side to that coin is that the Continua dual interface concept is likely to cause user frustration given the lack of interoperability between the two specifications, which negatively impacts the wide adoption of telehealth systems. There are also many end-user scenarios that could benefit from the support of both standards with the end-goal of either enhancing user experience or improving health risk detection. For example, the electrocardiograph of a patient suffering from cardiac arrhythmia could continuously stream heart activity data, either through a Zigbee gateway or BLE-enabled cell phone (depending on the availability of these two standards in a given space-time), thereby providing instant alerts and potentially saving lives as a result.

Supporting both BLE and Zigbee within the same device does not necessarily mean that the overall cost of a sensor node would double. Indeed, both solution types not only have many functional blocks in common but also present several similarities at both the application layer (with the use of a similar object-oriented database concept for the provision of dedicated services) and even more so at the radio level. More precisely, BLE waveform uses a Gaussian Minimum Shift Keying (GMSK) modulation scheme while Zigbee is based on Offset QPSK (O-QPSK) with half-sine pulse shaping, which is similar to GMSK but with the removal of the Gaussian shaping filter. As such, it is possible to easily support both standards through the use of a reconfigurable transceiver with a digital IF sub-sampling architecture on the receiver side (Figure 2).

Figure 2: Digital IF sub-sampling radio architecture

In this case, the input signal is first amplified and down converted to an intermediary frequency before being filtered and sub-sampled. Sub-sampling has the effect of generating a replica of the original spectrum at a lower frequency close to DC. This alias signal is then processed digitally where it is first centered at DC before getting low-pass filtered and finally demodulated. Being massively digital and entirely reconfigurable, this radio architecture allows the support, at a zero cost premium versus single-mode Zigbee or BLE solutions, of both standards for more safety and improved customer satisfaction. Moreover, it presents the additional advantage of being cognitive since it would be possible to adjust the performance level to a given radio context. In other words, linearity, sensitivity and filtering levels could all be dynamically modified as a function of propagation losses and interference level conditions at a given time, thereby further reducing peak power and increasing battery life.

However, the Continua dual-interface is not the only showstopper to wide adoption of telehealth systems. The lack of flexibility and limited integration level of existing IC solutions will also prevent telehealth products from reaching critical mass worldwide. In order to realize custom telehealth products with a high level of integration and in a cost-effective manner, one has to adopt a different approach than the one presently used (2D SoC integration) through the design of a modular 3D-IC. The latter, leveraging Cu-Cu direct and Ox-Ox molecular bonding techniques, consists of stacking up to 5 dies (Figure 3) depending on the configuration chosen by a given client: a base die implementing the whole BLE standard and a portion of the Zigbee specification, a complementary die supporting the remaining functions for the realization of a complete Zigbee solution, a MEMS sensor die (e.g. accelerometer, pressure…, a passives die integrating some RLC components into silicon, and a power/energy scavenger die (e.g. thermoelectric, kinetic generator…).

The advantages associated with this approach include: a separate and optimized technology process for each die, flexibility for the realization of custom solutions, lower power drivers, easy upgrade, and smaller footprint. Benefits also importantly include lower development costs and higher manufacturing volumes.

Figure 3: Modular 3D-IC architecture for Continua-certified telehealth applications and associated software stacks

Additionally, a modular 3D-IC approach is also well suited to needs of the future textronics industry, which will consist of integrating electronic components directly into textile. More precisely, 3D-IC physiological sensors could be inserted within the fabric of a garment by using a chip insertion technique such as Diabolo developed by the CEA-LETI. Diabolo places, within the textile fabric, extensible metallic wires onto which electronics components are attached. Presently the metallic wires are only used as mechanical support for the insertion of basic ICs such as LEDs and passive RFID tags. But one could imagine a more elaborate design whereby a health sensor 3D-IC is used instead.

This health sensor node could be made of two parts: an energy-scavenger/thermopile and a wireless sensor node (WSN) 3D-IC as shown in figure 4 below. The thermopiles, through the use of thermocouples connected in series, would convert the thermal energy dissipated by the human body into electrical energy. Indeed, it is already possible to achieve a significant level of electrical energy, in the order of 4mW/cm2 with a 5° temperature difference by bonding two wafers with P-type thermo-elements on one side and N-type thermo-elements on the other, so that a high density of thermocouples is achieved. The generated electrical energy would then be distributed through the metallic wires to the power chip of the 3D-IC where it would be conditioned, stored and finally distributed to the remaining parts of the WSN 3D-IC

Figure 4: Textronics integration of a telehealth sensor 3D-IC

While the telehealth market potential as a whole including such market segments as sports/fitness, chronic disease management and aging independently is indeed promising – with estimates between $1.9B and $4.6B by 2014 according to market analysts. Technical roadblocks and regulatory ones have prevented this market from reaching its full potential so far. However, this situation will change with the introduction of a modular, reconfigurable and cognitive 3D-IC approach that allows for the realization of custom telehealth systems in a cost-effective and highly integrated manner, while dynamically and power-efficiently supporting the complete set of sensor communication methods defined by the Continua Health Alliance.

About the Author

Pierre Gandolfo is the CEO and founding member of TrIP-Sen, a fabless semiconductor company focused on telehealth and other healthcare applications. Gandolfo has worked for over ten years in advanced wireless technologies within the consumer multimedia and remote control/monitoring spaces, having specialized in the development and commercialization of IC and system products based on IEEE 802.11, Bluetooth, DECT, WiMedia and 802.15.4a UWB-IR standards.

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The Cortex-A15 Processor–Enabling Next Generation Power-Efficient Computing

十月 1, 2010
By

 

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The Cortex-A15 Processor–Enabling Next Generation Power-Efficient Computing

ARMv7 roadmap overview

ARMv7 virtualization architecture extensions

AMBA 4 AXI interconnect enabling multi processor SoC coherency

LPAE, Security and soft fault recovery technology

 

http://www.eetimes.com/electrical-engineers/education-training/webinars/4208769/Cortex-A15-Processor-Enabling-Next-Generation-Power-Efficient-Computing-UK?cid=NL_CommsDesign

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