EE Times

Linux groups launch Tizen to fight Android

十月 2, 2011
By

Linux groups launch Tizen to fight Android

Peter Clarke   9/28/2011 11:00 AM EDT

http://www.eetimes.com/electronics-news/4228466/Linux-Tizen-Android?cid=NL_EETimesDaily

LONDON –

Two Linux oriented non-profit groups,

The LiMo Foundation and The Linux Foundation,

have announced an open-source project called Tizen,

intended to develop a mobile device software platform based on the Linux operating system.
In what appears to be an attempt to re-invent what search-engine giant Google has achieved with its Android platform, the groups said Tizen would be a standards-based, cross-architecture software platform that supports multiple device categories including smartphones, tablets, smart TVs, netbooks and in-vehicle infotainment systems.

The initial release of Tizen is targeted for Q1 2012, enabling first devices to come to market in mid-2012.
Intel will drop its own MeeGo mobile OS initiative in favor of Tizen and reportedly Samsung, a heavy supporter of Android, will seek to reduce its dependency on Google by backing Tizen.
Tizen is set to combine the open-source offerings from LiMo and The Linux Foundation and add HTML5 and web development environment within which device-independent applications can be produced efficiently for cross-platform deployment.

The LiMo Foundation (www.limofoundation.org) was founded by Motorola, NEC, NTT DoCoMo, Panasonic Mobile Communications, Orange, Samsung Electronics, and Vodafone with the aim of increasing the adoption of Linux within the mobile industry. It includes ARM, Marvell, Renesas and Intel subsidiary Wind River as associate members.
The Linux Foundation (www.linuxfoundation.org) is much broader but has seven platinum members at the top of its organization: Fujitsu, Hitachi, IBM, Intel, NEC, Oracle and Qualcomm.
Morgan Gillis, executive director of The LiMo Foundation decribed Tizen as a "renewed ecosystem" for mobile Linux proponents. The Limo Foundation said that the mobile industry is embracing Linux and open source technologies, but the creation of Tizen appears to be an acknowledgement that the open-source Linux has failed to gain traction in competition against the open but Google-owned Android. The other successful approach towards mobile systems has been the proprietary one of Apple Inc.
The Tizen project promises to lower device realization cost, increase flexibility and improve time to market for system developers.
The Tizen project is being hosted by the The Linux Foundation but has its own website at www.tizen.org

Related links and articles:
www.tizen.org
www.limofoundation.org
www.linuxfoundation.org

News articles:
Intel Lags in Mobile Shift Paid
Intel says will find partners for MeeGo
Nokia’s Microsoft deal clouds Finn’s future

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Latest 32-bit RISC architecture for automotive expands functionality

八月 22, 2011
By

Latest 32-bit RISC architecture for automotive expands functionality

Michael Krämer, Renesas  1/21/2011 12:40 PM EST

http://www.eetimes.com/design/automotive-design/4212389/Latest-32-bit-RISC-architecture-for-automotive-expands-functionality-?cid=NL_CommsDesign&Ecosystem=communications-design

During the 15 years since it was launched, Renesas V850 architecture has become a dominant architecture in the automotive electronics area. This Product How-To describes the features, including a SIMD coprocessor, incorporated into the latest variant, the V850E2H.

All V850 products are upwards compatible. As a result, today’s sophisticated components can still execute the same instructions as their forebears. The architecture has undergone continual improvements with extensions to the instruction set, and today it offers computing power of up to 2.6 Dhrystone MIPS/MHz. Further performance increases can be achieved by integrating several of these processor cores on a single chip, delivering twice or even four times more computing power.
The V850 architecture
All variants of the V850 are based on a 32-bit Harvard architecture, meaning that the CPU register and the ALU are 32 bits wide and that two 32-bit buses are provided internally, one for instruction transfers and the other for data access. In an ideal situation, each CPU cycle enables an instruction to be executed while simultaneously providing or writing the data.
As CPU clock rates have increased far faster than memory access times, precautions need to be taken to ensure that the memory does not slow down the CPU. This is why buses for Flash memory are designed 128 bits wide, except for components in the absolute lowest price segment. This enables up to eight instructions to be read simultaneously with one bus access, as the V850 instructions are 16, 32 or 48 bits wide. In addition, instruction caches are also implemented in most of the product derivatives to reduce the number of accesses to the relatively slow Flash memory.
The register set includes 32 32-bit registers. The instruction set is mostly symmetrical, so every instruction can be applied to every register. Special purpose registers like stack pointers, link pointers and parameter transfer registers are assigned by software development tools, not by the architecture. One exception is the r0 register whose content is always zero, as in many RISC architectures.

Extensions to the V850E2H architecture

All the functions mentioned above are also available in the new V850E2H architecture. Major new functions include the SIMD coprocessor (as well as branch prediction), which will be described, briefly, below. (For a detailed description, read a more extensive version of this article here, courtesy of Automotive Designline Europe.)

SIMD architecture
SIMD stands for “single instruction multiple data”

– in other words, processing several operands with a single command.

This unit is therefore particularly well-suited to digital signal processing, which mostly needs simple and basic operations like multiplication and addition but also needs to execute them very frequently and very fast.

The SIMD unit has access to 32 dedicated 64-bit vector registers.

With a single command, it therefore processes 64-bit wide vectors that are divided into two 32-bit or four 16-bit operands.

The SIMD unit has full access to the CPU’s data bus and can therefore read its registers from memory and write the results back there.

This is facilitated by the implementation of addressing methods, such as modulo addressing and automatic address incrementing, that are very useful for filter calculations.

It also supports bit-reverse addressing which is required for fast Fourier transformation (FFT).
The instruction set includes the obligatory multiply-and-accumulate instructions, data type conversions, and the retrieval of maximum and minimum values. Filter and FFT calculation with complex numbers is also supported.
The future: Multicore
To facilitate scalability from the low-cost to the premium segment, Renesas has already announced its first derivative with virtual CPU cores and hardware threading. Although this is basically a single-core CPU, it has several register files. Each clock cycle uses hardware to connect one of these register files to the execution unit. In this way, the individual threads are processed within their own hardware context, so there is no need for a software scheduler.

A scheduling table defines which thread the execution unit uses

– if any – and for how long.

Although this architecture only includes a single execution unit, from the software’s perspective it looks like each thread has its own CPU.

This virtualization ensures the downwards scalability of a multicore system.
Graduate physicist Michael Krämer studied physics at the Darmstadt Technical University. Since 2006 in Renesas Electronics’Automotive Business Unit, he is member of the global CPU Core Working Team.

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Bits from Hot Chips: Robots, Cisco, Oracle

八月 22, 2011
By

Bits from Hot Chips: Robots, Cisco, Oracle

Rick Merritt  8/19/2011 7:02 PM EDT

http://www.eetimes.com/electronics-news/4219157/Bits-from-Hot-Chips–Robots–Cisco–Oracle

Researchers demonstrated personal robots, Oracle discussed its latest server processor and Cisco described an Ethernet chip on the last day of Hot Chips.

PALO ALTO, Calif. – Researchers demonstrated personal robots, Oracle debuted its latest server processor and Cisco described an Ethernet chip on the last day of Hot Chips here.

"As an industry we’ve basically saturated what you can do with a robot behind a cage for industrial uses—the next 50 years will be about personal robots," said Steve Cousins, chief executive of Willow Garage, in a keynote describing and demonstrating the company’s latest robot.

A video of his demo is online on YouTube here or at the EE Times video site here.

The robot uses two eight-core Intel Westmere processors in its base and a Microsoft Kinect sensor on its head as a navigation aid. The components are less than ideal.

The processors require a loud fan for cooling and are easily swamped by still nascent programs for object recognition and robot decision making. The Kinect is useful but "we need better sensors—it’s hard to get a camera that’s even close to what the human eye sees," said Cousins.

Besides the Kinect, the robot uses nine video cameras and two laser scanners taken from garage door controllers. "All we get are hand-me-downs," said Cousins.

He called for low power, high performance processors that support large shared memory operations. He also called for specialized processors that could work in tandem with a variety of touch and camera sensors.

For its part, Oracle gave the first look inside the T4, a next generation Niagara family server processor using a new out-of-order, dual-issue core. Engineers got a stunning five-fold integer and seven-fold floating point boost on the T4, despite ratcheting back from 16-cores on the previous T3 versus just eight cores on the new chip.

Oracle’s T4 uses a new dual-issue core that accepts eight threads.

Inside Oracle’s T4, Cisco’s Sereno

Oracle is continuing its aggressive support of eight threads per core, started under the former Sun Microsystems. "We think we still lead in threads per chip, and we will continue to do so," said Robert Golla, a senior hardware architect at Oracle.

The new S3 core will be the basis for future Oracle processors. It sports extensive new branch prediction and pre-fetch features, a new dynamic threading approach for mixed workloads and a 16-stage integer pipeline running at more than 3 GHz. The core adds a handful of new instructions to boost performance on cryptography and some Oracle-specific apps.

Except for a new crossbar and cache design, the 40nm TSMC chip uses similar blocks as the prior T3 chip. The T4 has been running in lab all year but has not yet been released in systems.

Finally, Cisco Systems described Sereno, a 40 Gbit/s Ethernet ASIC it will use in its next-generation servers. The chip includes a mix of virtualization and networking features not found in merchant chips, Cisco engineers said.

Popular systems software such as Microsoft Windows Server and VMWare’s ESX do not support the so-called SR-IOV virtualization defined by the PCI Special Interest Group.

So Cisco designers created their own I/O virtualization technology for its chip, letting it act as up to 256 Ethernet virtual interfaces to the system, each with its own VLANs, multicast, filters and other capabilities.

The chip includes a MIPS R24K processor to handle network management jobs, including tracking up to 16 million network flows, offloading work from the server host CPU. The chip also groups its interrupts so as not to generate "interrupt storms" that swamp the host processor.

The 65nm chip was made at Texas Instruments, is running in the lab and going through system-level testing to ship with future Cisco servers.

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ARM wrestles with silicon, battery hurdles

八月 22, 2011
By

ARM wrestles with silicon, battery hurdles

Rick Merritt  8/19/2011 12:10 AM EDT

http://www.eetimes.com/electronics-news/4218909/ARM-wrestles-with-silicon–battery-hurdles

Big hurdles in silicon scaling and battery technology stand in the way of huge opportunities in mobile systems, said an ARM executive in a Hot Chips keynote.

PALO ALTO, Calif. – Big hurdles in silicon scaling and battery technology stand in the way of huge opportunities in mobile systems, said an ARM executive in a keynote here.

"Silicon scaling will end at some point, and I think it’s coming sooner than many people think," said Simon Segars, general manager of ARM’s physical IP division in a keynote at the annual Hot Chips event here.

What’s more, "we really need a new battery technology," he said.

With silicon atoms measuring a fraction of a nanometer in diameter and process technology approaching single nm digits, "you can only scale so far before we need other materials like III-V semiconductors," he said.

Difficulty delivering production-quality extreme ultraviolet (EUV) lithography is already creating problems. Chip makers must use complex double-patterning techniques with today’s immersion systems while they wait for EUV that may be required for the 14nm node, Segars said.

"You need to produce 200-300 wafers an hour, and today’s EUV machines can do about five wafers per hour now," said Segars. "Some people question whether it ever will be mainstream–lots of R&D still needs to go into it," he added.

Design issues loom large, too. 4G modems could be 500-times the complexity of 2G versions, requiring dedicated data-processing engines.

The need for more performance and power is driving up the complexity in multiple power domains and timing closure, he said. Nevertheless, the ARM exec promised advances including by 2015 Cortex A15 processors fully coherent across multiple CPUs and GPUs.

Battery technology looks equally challenging, increasing only about 11 percent a year, far behind the pace of Moore’s Law. Even maintaining that sluggish rate "will require some exotic materials such as silicon alloys or carbon nanotubes—batteries are really rubbish," he said.

On the other side of the hurdles are huge mobile opportunities. "All the numbers are big," said Segars, noting sales of 280 million smartphones last year and a market of four billion cellular subscribers.

"Although we have made fantastic progress there are a few issues ahead and the future won’t be like the past," he warned.

Delays in EUV threaten progress toward 14nm, Segars said.

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TI says OMAP not for sale

八月 22, 2011
By

TI says OMAP not for sale

Dylan McGrath  8/17/2011 3:40 PM EDT

http://www.eetimes.com/electronics-news/4218873/TI-says-OMAP-not-for-sale

Texas Instruments said its OMAP multimedia applications processor line is not for sale, contrary to widely circulated rumors.

SAN FRANCISCO—Texas Instruments Inc. said Wednesday (Aug. 17) that its OMAP multimedia applications processor line is not for sale, contrary to widely circulated rumors.
A spokesperson for TI said via email that the company is aware of speculation in the press about the sale of the OMAP business and wanted to set the record straight. Rumors about the potential sale of the company’s OMAP division are inaccurate, the spokesperson said. 
"To be clear, these are rumors, plain and simple," the spokesperson said. "They are not true, and were not started by TI. TI remains committed to our core wireless business, which encompasses the OMAP applications processors and wireless connectivity solutions. And, we are committed to helping our customers succeed in the marketplace."
Rumors have been circulating for several weeks that TI was considering the sale of its OMAP division.  Rumored suitors for the OMAP division included Broadcom Corp. and Advanced Micro Devices Inc. Last week, Will Strauss, principle analyst at market research firm Forward Concepts Inc., speculated that even Intel Corp. might be a potential fit for the ARM-based OMAP line.

TI previously declined to comment on the rumors, citing long-standing company policy not to comment on rumors or speculation about mergers, acquisitions or divestitures.

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IEEE 1588 Precision Time Protocol IP for Microsemi’s SmartFusion cSoCs

八月 22, 2011
By

IEEE 1588 Precision Time Protocol IP for Microsemi’s SmartFusion cSoCs

Clive Maxfield  8/16/2011 11:26 AM EDT

http://www.eetimes.com/electronics-products/electronic-product-reviews/fpga-pld-products/4218823/IEEE-1588-Precision-Time-Protocol-IP-for-Microsemi-s-SmartFusion-cSoCs?cid=NL_ProgrammableLogic&Ecosystem=programmable-logic

Microsemi Corporation has just announced the availability of IP and a reference design for IEEE 1588 Precision Time Protocol (PTP) on its SmartFusion customizable system-on-chip (cSoC) devices. Microsemi’s new Core1588, part of Microsemi’s DirectCore IP and Libero IDE software tools, is offered through Microsemi’s SmartDesign IP catalog.
According to information technology research and advisory company, Gartner, Inc., the worldwide spending on programmable devices such as SmartFusion cSoCs within the industrial market is expected to increase by more than 50 percent from 2011 to 2015.
"Our Core1588 allows us to cater to the needs of our customer base and support the growing adoption of SoCs in industrial applications," said Rich Kapusta, vice president terrestrial products, SoC Products Group at Microsemi. "The evolving needs of designers in this space will continue to be an important focal point for Microsemi as we expand IP ecosystems for our award-winning SmartFusion cSoCs."
Microsemi’s Core1588 provides hardware support for the implementation of IEEE 1588 PTP capable systems, and interacts with firmware provided in the reference design. The IEEE 1588 PTP allows synchronization of devices connected to an Ethernet network with a high level of accuracy. One of the devices on the network serves as the master clock, while the other devices behave as slave clocks synchronizing to the master clock’s value. The master clock is dynamically selected among the PTP capable devices on the network. The IEEE 1588 best master clock (BMC) algorithm is used to determine which device should be used as the master clock device.

SmartFusion cSoCs are the only devices that integrate an FPGA, a complete microcontroller built around a hard ARM Cortex-M3 processor, and programmable analog fabric, enabling full customization, IP protection, and ease-of-use. Based on Microsemi’s proprietary flash process, SmartFusion devices are ideal for hardware and embedded designers who need a highly integrated SoC that provides more flexibility than traditional fixed-function microcontrollers, and significantly reduces the cost of soft processor cores on traditional FPGAs.
Microsemi offers a full featured reference design for Core1588, targeted to its SmartFusion evaluation and development kits with Core1588 to qualified customers at no charge. For more information, visitwww.microsemi.com/soc.


If you found this article to be of interest, visit Programmable Logic Designline where you will find the latest and greatest design, technology, product, and news articles with regard to programmable logic devices of every flavor and size (FPGAs, CPLDs, CSSPs, PSoCs…).
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HP to spin out PCs, drop webOS products

八月 20, 2011
By

HP to spin out PCs, drop webOS products

Dylan McGrath  8/18/2011 3:47 PM EDT

http://www.eetimes.com/electronics-news/4218903/HP-to-spin-out-PCs–drop-webOS?cid=NL_EETimesDaily

Hewlett-Packard CEO Léo Apotheker confirmed that rhe company will explore the spin out or sale of its PC business and said HP would discontinue operations for webOS devices, specifically the TouchPad tablet and webOS phones.

SAN FRANCISCO—Hewlett-Packard Co. Thursday (Aug. 18) confirmed that it would explore the spinout or sale of its PC business and announced that it would discontinue operations for webOS devices, specifically the TouchPad tablet and webOS phones.
HP (Palo Alto, Calif.) issued a statement about the PC spinout after it was reported by the Bloomberg news service and the Wall Street Journal. HP also announced an agreement to acquire Autonomy Corp., an enterprise software firm based in Cambridge, England, for roughly $10.2 billion.
In a conference call, HP CEO Léo Apotheker said that the PC market is undergoing rapid transformation and that HP’s PC business needs flexibility and agility in order to remain the world’s largest PC vendor, and that the company would explore the possibility of a spinout of the unit or another transaction. This exploration is expected to take 12 to 18 months,Apotheker said.
HP said its board of directors authorized the exploration of strategic alternatives for its Personal Systems Group, the firm’s PC marketing unit. HP is the largest PC seller in the world, with market share of about 18 percent total across desktops and notebooks.
Also Thursday, HP cut its sales forecast for fiscal 2011, saying it now expects revenue of about $127.2 billion to $127.6 billion, down from its previous estimate of $129 billion to $130 billion.
The discontinuation of products that run webOS, the operating system HP acquired when it bought Palm Inc. in 2010, came as a suprise. Apotheker indicated that it was a difficult decision, but that HP’s webOS products were not selling adequately. "Our webOS devices have not gained enough traction in the market among consumers an we see too long a ramp up," Apotheker said.
Apotheker said HP would explore strategic alternatives for developing webOS and the webOS ecosystem.
Market research firm Technology Business Research Inc. (TBR) said in a report circulated Thursday that the acquisition of Autonomy indicates that HP may finally move "all in" on both cloud and business analytics. In making the deal, Apotheker proves his ongoing commitment to software as a main driver of HP’s corporate future according to TBR.
Also Thursday,

HP reported preliminary sales of $31.2 billion for its fiscal third quarter, up from $30.7 billion for the same period last year.

The company reported a earnings per share in accordance with generally accepted accounting principles (GAAP) of 93 cents, up from 75 cents in the year-ago quarter.

On a non-GAAP basis, excluding charges, HP reported earnings per share of $1.10, up from $1.08 in the yar-ago quarter.
HP’s fiscal third quarter sales and non-GAAP earnings per share were in line with consensus analysts’ expectations, according to Yahoo Finance.
For the current quarter, HP said it expects sales of $32.1 billion to $32.5 billion.

The guidance fell short of consensus analysts’ expectations, which called for sales of $34 billion, according to Yahoo Finance.

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SATA-IO unveils two interface standards: SATA Express and SATA µSSD

八月 17, 2011
By

SATA-IO unveils two interface standards: SATA Express and SATA µSSD

Ismini Scouras  8/12/2011 10:36 AM EDT

http://www.eetimes.com/electronics-products/memory-products/4218748/SATA-IO-unveils-two-interface-standards–SATA-Express-and-SATA–SSD?cid=NL_MCU&Ecosystem=microcontroller-mcu

The Serial ATA International Organization (SATA-IO) made two key announcements this week:  it is developing SATA Express, a new specification that combines SATA software infrastructure with the PCI Express (PCIe) interface and completed a new standard for embedded solid state drives (SSDs) dubbed SATA µSSD.

SATA Express enables the development of new devices that utilize the PCIe interface and maintain compatibility with existing SATA applications. The technology will provide a cost-effective means to increase device interface speeds to 8Gb/s and 16Gb/s.

Solid state (SSDs) and hybrid drives are already pushing the limits of existing storage interfaces. SATA Express will provide a low-cost solution to fully utilize the performance of these devices. Storage devices not requiring the speed of SATA Express will continue to be served by existing SATA technology. The specification will define new device and motherboard connectors that will support both new SATA Express and current SATA devices. 

"The SATA Express specification provides SSD and hybrid drive manufacturers the advantages of performance and scalability enabled by PCIe 3.0 – which is available now – and the ubiquity of SATA" said Mladen Luksic, SATA-IO president, in a statement.  "We expect the SATA Express specification to be completed by the end of 2011."

As for SATA µSSD, the specification eliminates the module connector from the traditional SATA Interface, enabling developers to produce a single-chip SATA implementation for embedded storage applications.

The µSSD standard offers a high-performance, low-cost, embedded storage solution for mobile computing platforms like ultra-thin laptops. The specification defines a new electrical pin-out that allows SATA to be delivered using a single ball grid array (BGA) package. The BGA package sits directly on the motherboard, supporting the SATA interface without a connecting module. By eliminating the connector the µSSD standard enables the physically smallest SATA implementation to date, making it well-suited for embedding storage in small form factor devices.

"As tablets and other small computing devices continue to proliferate in the market, the need for scalable small form factor storage solutions rises exponentially," said Luksic. "µSSD provides a new way to leverage the speed, reliability, and low power requirements of SATA technology in these types of products to enable powerful new computing platforms."

To access specifications: Click here.

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Android takes 48% of Q2 smartphone market

八月 14, 2011
By

Android takes 48% of Q2 smartphone market

Peter Clarke  8/8/2011 8:27 AM EDT

http://www.eetimes.com/electronics-news/4218585/Canalys-Android-smartphone?cid=NL_EETimesDaily
LONDON – The global smartphone market was 107.7 million units in 2Q11, an increase of 73 percent compared with 2Q10, according to market research firm Canalys Ltd.
Of the 56 countries Canalys tracks around the world, Android led in 35 of them and achieved a global market share of 48 percent. Asia Pacific (APAC) remained the largest regional market, with 39.8 million units shipping there, compared with 35.0 million in Europe, the Middle East and Africa (EMEA), and 32.9 million in the Americas, Canalys said.
Android became the leading smartphone platform in 4Q10 and its shipment were up in the second quarter by 379 percent compared with the same quarter a year before to 51.9 million units. Leading Android smartphone vendors include: Samsung, HTC, LG, Motorola, Sony Ericsson, ZTE and Huawei.
With shipments of 20.3 million and a market share of 19% in Q2, iPhones and iOS overtook Nokia’s Symbian platform during the quarter to take second place worldwide. In doing so, Apple displaced Nokia as the world’s leading smartphone vendor. Samsung also moved ahead of Nokia, Canalys reckons.

Related links and articles:
Analyst: Apple had 57% of Q2 handset profits
Tablets, smartphones hit sales of CE devices
Next iPhone looks to be an underachiever Paid

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ADI 技術資源中心

七月 22, 2011
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ADI 技術資源中心

http://www.eettaiwan.com/resource/index.do?sponsorId=1000002246&source=EE_CAT#T4

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在太陽能逆變器中利用iCoupler數位隔離器進行設計

ADI Tech Day 2011,立即報名

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