AMD

AMD 商用俱樂部

一月 2, 2012
By

AMD 商用俱樂部

http://www.amdtaiwan.com.tw/

 

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AMD Delivers Multi-Display Support With Longevity on Latest Entry-Level Embedded Discrete GPU

十月 3, 2011
By

September 26, 2011 00:01 ET

AMD Delivers Multi-Display Support With Longevity on Latest Entry-Level Embedded Discrete GPU

http://www.marketwire.com/press-release/amd-delivers-multi-display-support-with-longevity-on-latest-entry-level-embedded-discrete-nyse-amd-1565009.htm

AMD RadeonTM E6460 GPU Brings the Latest Desktop Graphics Performance and Features to the Casino Gaming, Digital Signage, Instrumentation and Industrial Controls Markets

BOSTON, MA–(Marketwire – Sep 26, 2011) – Today at Embedded Systems Conference East,AMD (NYSE: AMD) introduced the AMD Radeon™ E6460 discrete graphics processor as AMD’s next generation entry-level embedded graphics processor, complementing the previously announced AMD Radeon™ E6760. With support for up to four simultaneous displays and more than double the 3D graphics performance of the ATI Radeon™ E2400 GPU1, the AMD Radeon E6460 GPU sets a new bar for features and performance in an entry-level embedded GPU. With five years of planned supply availability and with the graphics memory included in the same package, the AMD Radeon E6460 GPU delivers the longevity, small footprint, and ease of design demanded by embedded system designers.

"The AMD Radeon E6460 GPU provides the high value, small footprint, and long supply demanded by embedded customers," said Richard Jaenicke, director of Embedded Client Business for AMD. "With a footprint-compatible subset of the high-performance AMD E6760 GPU, the new AMD Radeon E6460 GPU enables broadly scalable graphics and multimedia performance in a single board design."

The AMD Radeon E6460 GPU enables an immersive experience with desktop-level 3D graphics and multimedia features:

  • An advanced 3D graphics engine and programmable shader architecture supports Microsoft DirectX® 11 technology for superior graphics rendering.
  • The third generation unified video decoder enables dual HD decode of H.264, VC-1, MPEG4 and MPEG2 compressed video streams.
  • The 512 MB GDDR5 frame buffer included in the BGA package provides high memory bandwidth while reducing the total footprint of the platform solution and the effort needed to design and maintain the system over time.
  • Targeted at casino gaming, digital signage, instrumentation and industrial control systems, the AMD Radeon E6460 GPU enables system designers to deliver products with a value-conscious mindset.
  • One system design, multiple customer product categories. The BGA ballout of the AMD Radeon E6460 GPU is a subset of the higher performing AMD Radeon E6760 GPU enabling system designers to develop one system for both GPUs.
  • Featuring multi-display support with AMD Eyefinity technology, the AMD Radeon E6460 GPU supports up to four independent output displays2, HDMI 1.4 stereoscopic video and DisplayPort 1.2 for higher link speeds and simplified display connectivity.
  • The AMD Radeon E6460 GPU comes with five years of planned supply availability. Technical support is provided by a dedicated team of application engineering experts.

AMD Radeon E6460 GPU can be paired with select models of AMD’s next generation high-performance Accelerated Processing Units (APU) to offer additional graphics capability and additional parallel computing power.

AMD’s full portfolio of Embedded Products, including the award-winning AMD Embedded G-Series platform, will be on display in booth 801 at the Embedded Systems Conference East in Boston, Massachusetts.

Supporting Resources

About AMD
AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its groundbreaking AMD Fusion Accelerated Processing Units (APUs) that power a wide range of computing devices. AMD’s server computing products are focused on driving industry-leading cloud computing and virtualization environments. AMD’s superior graphics technologies are found in a variety of solutions ranging from game consoles, PCs to supercomputers. For more information, visit http://www.amd.com.

©2011, Advanced Micro Devices, Inc. AMD, the AMD Arrow logo, Radeon and combinations thereof, are trademarks of Advanced Micro Devices, Inc. DirectX is a trademark of Microsoft Corporation. Other names are for informational purposes only and may be trademarks of their respective owners.

1 System configuration: AMD Athlon™ II X4 620 @ 2.6GHz 4 Core, Gigabyte GA-MA770T-UD3P, Corsair XMS3 4GB (2x2GB) 1333MHz, Windows® 7 64bit Ultimate with 3DMark2006 v 1.2 and 3DMark Vantage v 1.0.2.

2 AMD Eyefinity technology works with applications that support non-standard aspect ratios, which is required for panning across multiple displays. To enable more than two displays, additional panels with native DisplayPort connectors, and/or DisplayPort compliant active adapters to convert your monitor’s native input to your cards DisplayPort or Mini-DisplayPort connector(s), are required. AMD Eyefinity technology can support multiple displays limited by display output clock dependencies and has certain restrictions on supported display interfaces. For AMD Radeon E6460, AMD Eyefinity technology supports up to 4 displays. Microsoft® Windows® 7, Windows Vista®, or Linux® is required in order to support more than two displays. SLS ("Single Large Surface") functionality requires an identical display resolution on all configured displays. AMD Eyefinity technology works with applications that support non-standard aspect ratios, which is required for panning across multiple displays.

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AMD debuts next-gen embedded graphics processor

九月 29, 2011
By

AMD debuts next-gen embedded graphics processor

Nicolas Mokhoff   9/26/2011 11:08 AM EDT

MANHASSET, NY — At Embedded Systems Conference Boston this week AMD is introducing its Radeon E6460, a next-generation entry-level embedded graphics processor that complements its Radeon E6760.
The E6460 supports for up to four simultaneous displays, more than doubles the 3-D graphics performance of the  E2400, and sets a new bar for features and performance in an entry-level embedded GPU.
AMD claims five years of planned supply availability of the E6460 GPU that sports on-board  graphics memory.
“The AMD Radeon E6460 GPU provides the high value, small footprint, and long supply demanded by embedded customers,” said Richard Jaenicke, director of Embedded Client Business for AMD, in a statement. “With a footprint-compatible subset of the high-performance AMD E6760 GPU, the new AMD Radeon E6460 GPU enables broadly scalable graphics and multimedia performance in a single board design.”
The E6460 the following 3-D graphics and multimedia features:

  • 3-D graphics engine and programmable shader architecture supporting Microsoft DirectX 11 technology.
  • unified video decoder enabling dual HD decode of H.264, VC-1, MPEG4 and MPEG2 compressed video streams.
  • 512 MB GDDR5 frame buffer in the BGA package with a ballout that is a subset of the higher performing E6760 GPU.
  • AMD Eyefinity technology enabling support of up to four independent output displays, HDMI 1.4 stereoscopic video and DisplayPort 1.2.

AMD is aiming the E6460 at casino gaming, digital signage, instrumentation and industrial control systems.

The company’s full portfolio of embedded products is on display in booth 801 at the Embedded Systems Conference Boston.

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AMD FX CPU

九月 14, 2011
By

超微處理器高時脈 創世界紀錄

AMD FX CPU 8.429 GHz

【11:20】

〔中央社〕美商超微(AMD)宣布即將推出的8核心AMD FX桌上型處理器已登上金氏世界紀錄，獲得「最高時脈的電腦處理器」封號；FX處理器第4季就會上市，且不鎖頻，讓用戶自由超頻。
AMD全球副總裁暨終端產品事業群總經理Chris Cloran表示，AMD FX CPU刷新紀錄的處理器時脈速度，展現Bulldozer多核心架構的效能；這個架構將為AMD FX CPU以及未來的AMD加速處理器提供超高的x86運算能力。
超微表示，除了打破世界紀錄（Guinness World Record）的時脈，AMD FX處理器也可帶給使用者高效的個人電腦(PC)體驗，適合用於支援多螢幕遊戲、多工運算、以及高傳真(HD)內容製作。達到金氏紀錄是超微的里程碑，要讓使用者感受完全沒有束縛、令人驚奇的PC體驗。
超微表示，AMD FX CPU預計今年第4季上市，最高時脈達8.429 GHz，超越先前的8.308 GHz紀錄。

這個紀錄是由「Team AMD FX」團隊今年8月31日在美國德州奧斯汀市所創下，團隊和AMD技術人員也被列入金氏世界紀錄。
超微表示， FX品牌旗下所有產品，包括即將推出的AMD FX CPU在內，將完全不鎖頻，以便用戶自由超頻，另外還透過AMD VISION Engine內附的AMD軟體，讓使用者能自行微調系統效能的設定。
AMD針對FX品牌處理器移除所有的封鎖，帶給超頻玩家與PC愛好者完整的客製化功能與充裕彈性。

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AMD Embedded G-Series Platform

四月 26, 2011
By

AMD Embedded G-Series Platform

http://www.amd.com/us/products/embedded/processors/Pages/g-series.aspx

The world’s first combination of low-power CPU and advanced GPU integrated into a single embedded device.

The AMD Embedded G-Series platform is the world’s first integrated circuit to combine a low-power CPU and a discrete-level GPU into a single embedded Accelerated Processing Unit (APU).

This unprecedented level of graphics integration builds a new foundation for high performance multi-media content delivery in a small form factor and power efficient platform for a broad range of embedded designs.

Based on a brand new power-optimized core, the AMD Embedded G-Series platform delivers new levels of performance in a compact BGA package that is ideal for low power designs in embedded applications such as Digital Signage, x86 Set-Top-Box (xSTB), IP-TV, Thin Client, Information Kiosk, Point-of-Sale, and Casino Gaming, media servers and industrial control systems.

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AMD to back USB 3.0 in its chips

四月 15, 2011
By

 

AMD to back USB 3.0 in its chips

April 12, 2011 12:27 PM PDT

Read more: http://news.cnet.com/8301-13924_3-20053123-64.html#ixzz1JXtr9MIV

Advanced Micro Devices will support USB 3.0 in its chips, marking the first instance of a major PC processor supplier getting behind the standard. Intel has yet to support the high-speed interface.

The USB Implementers Forum today announced that AMD will deliver the first chipsets to integrate support for USB 3.0, aka SuperSpeed USB. A chipset accompanies the main processor.

"With [today's] announcement AMD is…disclosing our support for SuperSpeed USB 3.0 in upcoming AMD A75 and A70M Fusion [chipsets]. Both chipsets are shipping today," said Phil Hughes, an AMD spokesman, responding to an e-mail query.

The current USB 2.0 standard, which is found on virtually all laptops today, has been around for an eternity in tech years. Intel laid the groundwork for widespread use on PCs and devices in spring 2002 when it put the technology in its silicon. Eight years later, the advantages of moving to a faster standard are clear for devices like digital cameras, camcorders, and hard drives: transfer rates jump from a peak of 480 megabits per second on USB 2.0 to as much as 5 gigabits per second with USB 3.0.

But mass adoption by PC makers won’t happen until support is included in chipsets, according to Brian O’Rourke, an analyst at In-Stat. "In order for the rippling effect to happen with USB 3.0 it has to hit in PCs and for it to hit in PCs it has to be integrated into the chipset. AMD is not Intel, but it’s probably the next best thing in chipsets," O’Rourke said. Currently, USB 3.0 is integrated into PCs by adding a separate chip, typically from NEC.

If mass adoption happens, it will take place in laptops first. "USB 3.0 is really gaining traction first in mobile PCs," O’Rourke said. And it’s not just because of the higher transfer speeds. The standard also provides more power to devices, such as external hard disk drives. "A USB 3.0 host can deliver a minimum of 80 percent more power than a USB 2.0 host," according to O’Rourke. The standard is also more energy frugal, O’Rourke said.

USB 3.0 merits:

  • Speed: About 10 ten times faster than USB 2.0.
  • Power: Better able to power devices like external hard disk drives.
  • Power efficiency: No device polling and lower active and idle power requirements.
  • Backward compatible: Supports USB 2.0 legacy devices.
  • Laptops shipping today: Hewlett-Packard, Dell, and Toshiba are shipping laptops today with USB 3.0.
  • Future support in small laptops: Netbook-size laptops using AMD’s Fusion chip can support USB 3.0.

Not all of the pieces are in place yet for USB 3.0 to take off, however. "The only peripheral devices with USB 3.0 out there right now are external hard drives and a few flash drives. Why? There aren’t any peripheral controllers for USB 3.0 in general release yet. Not any out there on the market yet," O’Rourke said.

O’Rourke continued. "So, that has to happen. The peripheral controllers don’t get produced in any large volume until there are a lot of [consumer] devices out there and there are not going to be a lot of devices [that support USB 3.0] until USB 3.0 is integrated into chipsets. That’s why the AMD announcement is so important. It starts to drive the engine that will create widespread adoption."

And what about Intel? Intel is now putting its considerable weight behind Thunderbolt tech, which is now shipping with Apple’s 2011 MacBook Pro line. Intel has stated that Thunderbolt will complement USB 3.0, not replace it. And the world’s largest chipmaker has also said that it plans to integrated USB 3.0 support in future silicon.

And it may take Intel’s support to make the standard truly universal. "Intel still commands too much [chip] market share for AMD’s move to make a difference," said Rich Brown, an editor at CNET Reviews.

Read more: http://news.cnet.com/8301-13924_3-20053123-64.html#ixzz1JXthGOU2

http://news.cnet.com/8301-13924_3-20053123-64.html?part=rss&subj=news&tag=2547-1_3-0-20

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AMD Boosts Application Development for AMD Fusion APU-Powered PCs With Updated Software Development Kit

二月 6, 2011
By

SOURCE: Advanced Micro Devices

Jan 27, 2011 00:01 ET

AMD Boosts Application Development

for AMD Fusion APU-Powered PCs

With Updated Software Development Kit

http://www.marketwire.com/press-release/AMD-Boosts-Application-Development-AMD-Fusion-APU-Powered-PCs-With-Updated-Software-NYSE-AMD-1386264.htm

SUNNYVALE, CA–(Marketwire – January 27, 2011)

– AMD (NYSE: AMD) today announced availability of the updated AMD Accelerated Parallel Processing (APP) Software Development Kit (SDK) v2.3 with full support for the first AMD Fusion Accelerated Processing Units (APUs), OpenCL™ 1.1 and AMD Radeon™ HD 6900 Series graphics.

AMD APP technology enables AMD GPUs and CPUs to work together to run many demanding computing tasks faster than possible with just the CPU alone.

AMD Accelerated Parallel Processing SDK v2.3, previously known as the ATI Stream SDK, empowers software developers to write new applications that can take full advantage of the parallel processing power of heterogeneous computing platforms, such as those based on new AMD E-Series and C-Series APUs that combine a multi-core CPU and DirectX®11-capable GPU on a single die.

"When developers harness the power of parallel processing within our APU designs, they can fundamentally change the PC experience to help not only make it faster, but also to create new possibilities in software," said John Taylor, director of Client Product and Software Marketing, AMD. "In 2008, AMD was the first processor design company to embrace OpenCL, and as such, we have made significant progress in parallel processing innovation. Our vision has been realized with the widespread availability of the first PCs powered by AMD Fusion APUs."

"Industry standards like OpenCL and OpenGL, common APIs, and tools like the AMD APP library and SDK give application developers a shared environment that allows them to harness maximum hardware performance for amazing application experiences across platforms," said George Tang, vice president and general manager of ArcSoft’s Video and Home Entertainment Group. "By supporting these open standards, AMD is giving developers access to a programming environment that helps them more easily navigate the recent advances in computer hardware, including AMD’s APU technology." In addition to support for the first AMD Fusion APUs and OpenCL 1.1, AMD APP SDK v2.3 offers improved runtime performance and math libraries for OpenCL.

AMD Developer Summit
Improving OpenCL performance and programmability on AMD platforms is a key initiative for AMD, and this summer, AMD technical personnel, AMD executives, developers and partner companies will gather at the AMD Fusion Developer Summit to discuss industry standards including OpenCL, and to explore how to best optimize applications for heterogeneous computing.

The inaugural AMD Fusion Developer Summit (AFDS) will be held June 13-16, 2011 in Bellevue, Washington.

Presentation proposals are due by February 4, 2011. AFDS will gather developers, academics and emerging innovators to learn more about heterogeneous computing, APU technology, parallel processing and developer programs like the AMD Fusion Fund.

Resources

About AMD
AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its ground-breaking AMD Fusion Accelerated Processing Units (APUs). AMD’s graphics and computing technologies power a variety of devices including PCs, game consoles and the powerful computers that drive the Internet and businesses. For more information, visithttp://www.amd.com.

AMD, the AMD Arrow logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos.

Contact:
Jo Albers
AMD Public Relations
(512) 602-3526
Email Contact

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AMD新APU 針對嵌入式打造

一月 26, 2011
By

 

AMD新APU 針對嵌入式打造

http://news.chinatimes.com/tech/12050901/122011012400264.html

AMD日前宣布AMD新款嵌入式G系列處理器正式上市，同時表示，該款處理器是全球首款也是唯一針對嵌入式系統所打造的的APU。

   AMD伺服器及嵌入式事業部全球副總裁暨總經理Patrick Patla表示，AMD G系列處理器採用AMD Fusion技術，提供一個完整的全功能嵌入式平台，並結合新款多核心且低功耗的x86處理器、堪稱世界級的DirectX 11繪圖處理技術與平行處理引擎，將這些元件全部嵌入到同一顆矽晶片內，提供給使用者最優異的處理效能。

  Patrick Patla說，此新款APU結合最完整的運算功能於單一晶片上，

是以往所有處理器尚無法達到的完整功能，對嵌入式系統而言是一個可以大幅增進其功能的市場機會。

現今嵌入式產品市場中，沒有任何其他解決方案具備此等級的先進運算能力。

目前已有多款系統採用AMD嵌入式G系列平台，

抑或在未來數週會發表相關產品，

包括研碩電腦（Advansus）、Compulab、Congatec、富士通（Fujitsu）、海爾（Haier）、威強工業電腦（iEi）、Kontron、Mitec、Quixant、Sintrones、Starnet、WebDT、慧智科技（Wyse）等眾多廠商。

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