TI tips IC portfolio for Thunderbolt interface

TI tips IC portfolio for Thunderbolt interface

3/22/2012 1:43 PM EDT

http://www.eetimes.com/electronics-news/4304106/TI-tips-IC-portfolio-for-Thunderbolt-interconnect-?cid=NL_EETimesDaily

Texas Instruments claimed to offer the semiconductor industry’s first IC portfolio optimized for the Thunderbolt high-speed interface standard.

SAN FRANCISCO—Texas Instruments Inc. this week claimed to offer the semiconductor industry’s first IC portfolio optimized for the Thunderbolt high-speed interface standard.
Thunderbolt, which was developed by Intel Corp., is an interconnect technology that supports dual 10.3 Gbps transfer lanes, aggregating PCI Express and DisplayPort to enable both data and display over a single cable.
TI (Dallas) claims to be the only chip supplier to provide a full ecosystem of devices for Thunderbolt, allowing customers to do more by offering the right products to speed design.
TI’s initial Thunderbolt product offering includes six devices.

The TPS22980 power load switch resides on both the host and device side, facilitating the delivery and receipt of power to both the active cable and the connected device, TI said.

The LM3017 boost and battery disconnect and HD3SS0001 FET switch work in tandem on the host to connect to the cable where the TPS22985 power load switch, DS100TB211 signal conditioning retimer with clock and data recovery (CDR) and LMZ10501 simple switcher nano module reside, the firm said.. All devices are designed to work seamlessly, TI said.
“Thunderbolt technology brings unprecedented I/O performance and versatility to the PC platform,” said Jason Ziller, director of marketing and planning for Thunderbolt technology at Intel.

“Texas Instruments’ new devices will accelerate Thunderbolt product makers’ development and time-to-market, and help accelerate Thunderbolt ecosystem growth.”

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